SK Hynix Stock Jumps 6% as HBM4E Chip Samples Ship to Major Customers

TLDR

• SK Hynix stock rose 6.51% after announcing it shipped HBM4E samples to major customers
• The 12-layer HBM4E chip hits speeds of 16Gbps per pin — more than 20% more power efficient than previous models
• The chip uses Advanced MR-MUF technology to achieve 48GB capacity while improving heat resistance by 17%
• SK Hynix is Nvidia’s primary HBM supplier, with Samsung and Micron competing for ground
• The company says it will work closely with partners toward mass production

SK Hynix announced Thursday it has shipped samples of its next-generation HBM4E memory chips to major customers, sending the South Korean chipmaker’s stock up 6.51% on the Korea Exchange. Rival memory stocks also moved, with Samsung rising 4.62% and Micron up 2.20%.

The HBM4E is a 12-layer, high-bandwidth memory chip built for AI applications. It processes data at a maximum speed of 16 gigabits per second per pin — and delivers more than 20% better power efficiency compared to its predecessor, HBM4.

HBM chips are key components inside AI processors, including those made by Nvidia. They handle the enormous volumes of data required to train and run AI models. Without them, the chips that power large-scale AI simply can’t do their job.

SK Hynix is Nvidia’s main HBM supplier. Samsung and Micron are working to close the gap, but SK Hynix has held its lead through successive generations of the technology — HBM3, HBM3E, and now HBM4 and HBM4E.

The company said samples of the 12-stack HBM4E were delivered “on schedule,” pointing to its experience in HBM development and production as the reason it was able to hit that timeline.

What Makes HBM4E Different

The HBM4E cuts data transfer latency through interface and design improvements, while keeping stable operation in high-bandwidth environments. That matters for AI datacenters running round-the-clock workloads at scale.

SK Hynix uses a manufacturing process called Advanced MR-MUF — Mass Reflow Molded Underfill — which injects liquid protective material between stacked chips. This allows the company to hit a 48GB capacity in a 12-layer stack while improving heat resistance by 17% over HBM4.

Better heat resistance means memory chips can operate more reliably inside high-performance computing systems that generate a lot of thermal output.

Road to Mass Production

Ahn Hyun, SK Hynix’s President and Chief Development Officer, said the company has “laid the foundation to strengthen its AI leadership with HBM4E,” and that it will work with partners to deliver the product to market while maintaining its position as a “full-stack AI memory creator.”

The company stopped short of giving a specific mass production timeline, saying only that it will “work closely with partners for mass production in a timely manner.”

Nvidia’s stock dipped 1.33% on Thursday, a move not directly tied to the SK Hynix announcement.

The HBM4E sample shipments follow SK Hynix’s established track record supplying HBM3 and HBM3E to the market — generations that helped it cement its relationship with Nvidia before HBM4 entered the picture.

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